High-Speed Board To Board

HIGH-ISOLATION

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ISORATE® RF SYSTEMS
IsoRate® is a high-isolation interconnect system that can offer substantial savings over traditional RF connectors at approximately half the cost.

Features: 
- Half the cost of traditional RF at virtually the same performance
- Edge Rate® contacts for high-isolation
- 50 ohm board-to-board systems
- 50 ohm full ganged system or ganged with industry standard end 2 options
- Positive latching available

FLOATING RF SYSTEMS
Three piece "bullet" style systems offering misalignment compensation.

Features:
- Compensates for misalignment in X & Y directions
- Frequency range (SMP): DC to 40 GHz
- Frequency range (AFI): DC to 6 GHz
- Bullet adaptors allow for flexible connections

GANGED MICRO SCALE RF SYSTEMS
Samtec's ganged micro-miniature high-performance solutions are on a 5.00 mm pitch and available as board-to-board or cable-to-board systems.

Features:
- Performance up to 6 GHz
- 50 ohm and 75 ohm solutions
- Full ganged system or ganged with industry standard end 2 options
- Micro-miniature, rugged contacts
- Optional captive panel screws
- Single or double-ended cable assemblies
- Optional threaded inserts

ULTRA MICRO

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RAZOR BEAM™ LP
Ultra slim, ultra low profile and ultra fine pitch interconnects.

Features:
- Ultra fine pitch – 0.40 mm and 0.50 mm
- Ultra low stack down to 2.00 mm
- Slim body design for increased board space savings

EDGE RATE® CONNECTOR STRIPS
Rugged Edge Rate® contact systems optimized for signal integrity performance

Features:
- Edge Rate® contacts optimized for signal integrity performance
- Robust when "zippered" during unmating
- 0.80 mm or 0.50 mm pitch systems
- Stack heights from 7 mm to 16 mm
- 0.50 mm pitch system for up to 40% PCB space savings
 
RAZOR BEAM™ LP
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features:
- 10 stack height options from 5 mm to 12 mm
- Audible click when mated
- Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
- Up to 100 contacts
 
Z-RAY® ULTRA LOW PROFILE INTERPOSERS
Z-Ray® ultra low profile, high-density one-piece arrays with compression contacts.

Features:
- 1 mm standard body height
- Dual compression contacts
- Single compression with solder ball
- Performance up to 20 GHz / 40 Gbps
- 0.80 mm or 1.00 mm pitch standard
- Highly customizable system
 
SEARAY™ 0.80 MM PITCH ULTRA HIGH-DENSITY ARRAYS
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features:
- 0.80 mm (.0315") pitch grid
- 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
- Performance: Up to 17.5 GHz / 35 Gbps
- Rugged Edge Rate® contact system
- Up to 500 I/Os
- 7 mm and 10 mm stack heights
- Solder charge terminations for ease of processing
- Samtec 28+ Gbps Solution
- Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
 
LP ARRAY™ LOW PROFILE OPEN-PIN-FIELD ARRAYS
Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features:
- 4 mm, 4.5 mm, 5 mm stack heights
- Up to 320 I/Os
- 4, 6 and 8 row designs
- .050" (1.27 mm) pitch
- Dual beam contact system
- Solder crimp termination for ease of processing
- Performance up to 18.5 GHz / 37 Gbps

 

HIGH-DENSITY ARRAYS

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Z-RAY® ULTRA LOW PROFILE INTERPOSERS
Z-Ray® ultra low profile, high-density one-piece arrays with compression contacts.

Features:
- 1 mm standard body height
- Dual compression contacts
- Single compression with solder ball
- Performance up to 20 GHz / 40 Gbps
- 0.80 mm or 1.00 mm pitch standard
- Highly customizable system

SEARAY™ HIGH-DENSITY OPEN PIN FIELD ARRAYS
These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

Features:
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- Performance up to 18 GHz/pair
- Up to 500 I/Os in open pin field design
- 1.27 mm (.050") pitch and space saving 0.80 mm pitch
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- 7 - 17 mm stack heights
- Vertical, right-angle, press-fit
- Elevated systems to 40 mm
- 85 ohm systems
- VITA 47, VITA 57, Pismo 2 certified
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for - high-performance/harsh environment electronic products (SEAM/SEAF series only)
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh - environment electronic products (SEAM/SEAF series only)

SEARAY™ 0.80 MM PITCH ULTRA HIGH-DENSITY ARRAYS
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features:
- 0.80 mm (.0315") pitch grid
- 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
- Performance: Up to 17.5 GHz / 35 Gbps
- Rugged Edge Rate® contact system
- Up to 500 I/Os
- 7 mm and 10 mm stack heights
- Solder charge terminations for ease of processing
- Samtec 28+ Gbps Solution
- Final Inch® certified for Break Out Region trace routing recommendations (patent pending)

LOW PROFILE ONE-PIECE COMPRESSION ARRAYS
High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

Features:
- 1.27 mm and 2 mm standard body heights
- 1.00 mm pitch
- Dual compression or single compression with solder balls
- 100 – 400 total pins
- Ideal for low cost board stacking, module-to-board and LGA interfaces
- Minimizes thermal expansion issues
 
LP ARRAY™ LOW PROFILE OPEN-PIN-FIELD ARRAYS
Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features:
- 4 mm, 4.5 mm, 5 mm stack heights
- Up to 320 I/Os
- 4, 6 and 8 row designs
- .050" (1.27 mm) pitch
- Dual beam contact system
- Solder crimp termination for ease of processing
- Performance up to 18.5 GHz / 37 Gbps

SAMTEC EXAMAX® HIGH-SPEED BACKPLANE SYSTEM
ExaMAX® high-speed backplane interconnects deliver 28 Gbps electrical performance while offering a migration path to 56 Gbps.

Features:
- Enables 28 Gbps electrical performance on 2.00 mm column pitch
- Allows designers to optimize density or minimize board layer count
- Two reliable points of contact, even when subjected to angled mating
- Meets Telcordia GR-1217 CORE specification
- Individual signal wafers with staggered differential pair design; 72 or 40 pairs
- One-piece embossed ground structure on each signal wafer to reduce crosstalk
- Lowest mating force on the market: 0.36 N max per contact
- Stub free mating
- Press fit termination
- Power and Guide Modules available

SKYRAY™ HIGH-SPEED ELEVATED ARRAYS
This three-piece system features crosstalk-canceling technology delivering 28+ Gbps performance at elevated stack heights.

Features:
- Three-piece system
- Crosstalk canceling technology
- 28+ Gbps solution
- 35 mm standard stack height aids in system airflow
- Three-piece system reduces thermal mass during processing
- 50, 100, and 150 differential pairs
- 18 mm – 40 mm stack heights available
- 1.50 mm x 1.75 mm pitch
- Dual sourced By Hirose®

DEDICATED DIFFERENTIAL PAIR DP ARRAY®
Dedicated differential pair, high-density arrays designed for performance up to a terabit per connector.

Features:
- Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
- No return paths needed
- Fewer board layers required
- Performance: Up to 4 GHz per pair (up to a terabit per connector)
- Up to 168 usable pairs
- 10 mm stack height
- Lower insertion / extraction forces
- Solder crimp termination
 
HD MEZZ
Elevated high-density open pin field arrays up to 35 mm stack heights.

Features:
- Application specific capability to stack heights from 20 mm to 35 mm
- Open pin field design
- Performance: Up to 9 GHz / 18 Gbps
- Integrated guide posts to minimize contact damage when mating and unmating
- Solder charge terminations for ease of processing
- 2.00 mm x 1.20 mm pitch
- Up to 299 I/Os
- Intermateable with Molex HD Mezz Arrays
- HD Mezz is a trademark of Molex Incorporated
- Provides 0.50 mm (.0197") float in X and Y directions

RUGGED HIGH-SPEED STRIPS

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Q2™ RUGGED/HIGH-SPEED INTERCONNECTS
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features:
- Performance: Up to 8.5 GHz / 17 Gbps
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
- Power and RF ends options
- Contacts: Up to 208 I/Os
- Stack height: 10.00 mm-16.00 mm

EDGE RATE® CONNECTOR STRIPS
Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features:
- Edge Rate® contacts optimized for signal integrity performance
- Robust when "zippered" during unmating
- 0.80 mm or 0.50 mm pitch systems
- Stack heights from 7 mm to 16 mm
- 0.50 mm pitch system for up to 40% PCB space savings

Q RATE® SLIM, RUGGED HIGH-SPEED INTERCONNECTS
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features:
- Performance: Up to 15 GHz / 30 Gbps
- Rugged Edge Rate® contacts
- Integral ground/power plane
- Up to 156 positions
- Slim footprint (less than 5.00 mm wide)

RAZOR BEAM™
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features:
- 10 stack height options from 5 mm to 12 mm
- Audible click when mated
- Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
- Up to 100 contacts

FLOATING CONTACT SYSTEM
High-speed floating contact system minimizes mating alignment errors.

Features:
- Provides 0.50 mm (.0197") float in X and Y directions
- Ideal for multiple connectors on a board
- Up to 60 floating contacts
- Choice of body height and right-angle design

MEZZANINE STRIPS

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MEZZANINE STRIPS
Board-to-board systems to 28+ Gbps performance featuring integral ground planes, rugged Edge Rate® contacts, slim body and low profile stack heights.

Q STRIP® HIGH-SPEED INTERCONNECTS
Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential.

Features:
- Performance: Up to 14.0 GHz /28 Gbps
- Integral ground/power plane
- Connector to connector retention options
- Vertical, perpendicular, and coplanar applications
- Contacts: Up to 180 I/Os
- Stack height: 5.00 mm - 25.00 mm

Q PAIRS® DIFFERENTIAL PAIR INTERCONNECTS
Samtec Q Pairs® connectors are designed for high-speed board-to-board applications where signal integrity is essential.

Features:
- Performance: Up to 10.5 GHz / 21 Gbps
- Optimized for 100 ohm systems
- Integral ground/power plane
- Stack height: 5.00-25.00 mm
- Contacts: Up to 100 pairs

Q RATE® SLIM, RUGGED HIGH-SPEED INTERCONNECTS
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features:
- Performance: Up to 15 GHz / 30 Gbps
- Rugged Edge Rate® contacts
- Integral ground/power plane
- Up to 156 positions
- Slim footprint (less than 5.00 mm wide)

Q2™ RUGGED, HIGH-SPEED INTERCONNECTS
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features:
- Performance: Up to 8.5 GHz / 17 Gbps
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
- Power and RF ends options
- Contacts: Up to 208 I/Os
- Stack height: 10.00 mm - 16.00 mm

EDGE RATE® CONNECTOR STRIPS
Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features:
- Edge Rate® contacts optimized for signal integrity performance
- Robust when "zippered" during unmating
- 0.80 mm or 0.50 mm pitch systems
- Stack heights from 7 mm to 16 mm
- 0.50 mm pitch system for up to 40% PCB space savings

RAZOR BEAM™
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features:
- 10 stack height options from 5 mm to 12 mm
- Audible click when mated
- Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
- Up to 100 contacts