FOUR ROW HIGH-DENSITY
.050" (1.27 mm) X .050" (1.27) pitch board stacking interconnects with high-reliability Tiger Eye™ and high-retention Tiger Buy™ contact systems.

HIGH-RELIABILITY .050" X .050" PITCH QUAD ROW SYSTEM
Four row terminal and socket strips with up to 200 Tiger Eye™ contacts for high-reliability.

Features:
- High-density connector strips up to 200 pins
- High-reliability Tiger Eye™ contact system
- Four row staggered layout
- Optional locking clips and alignment pins

COST EFFECTIVE .050" (1.27 MM) PITCH QUAD ROW SYSTEM
Four row terminal and socket strips with up to 200 Tiger Buy™ pins on a staggered layout.

Features:
- High-density connector strips up to 200 pins
- High-retention Tiger Buy™ contacts
- Four row design
- Optional locking clips

.050" X .100"
.050" (1.27 mm) X .100" (2.54 mm) pitch board stacking interconnects available in socket and terminal strips, board stackers, low profile and skyscraper stack heights, pass-through, rugged, and high-density designs.

.050" X .100" PITCH SYSTEMS
Micro pitch, high-density pin and socket systems with choice of stack heights.

Features:
- Standard and high-temp designs
- Low profile and skyscraper board stacking
- Optional polarization, alignment pins and locking clips 
- Flex shroud available

COMPRESSION / ONE-PIECE
One-piece connectors for rugged, high-shock and vibration applications featuring robust designs, mechanical hold downs, screw downs, and low profile designs on 1.00 mm, 1.27 mm, 2.54 mm and .100" pitch.

Z-RAY® ULTRA-LOW PROFILE ARRAYS
Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.

Features:
- 1 mm standard body height
- Dual compression contacts
- Single compression with solder ball
- Performance up to 20 GHz / 40 Gbps
- 0.80 mm or 1.00 mm pitch standard
- Highly customizable system

LOW PROFILE ONE-PIECE COMPRESSION ARRAYS
High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

Features:
- 1.27 mm and 2 mm standard body heights
- 1.00 mm pitch
- Dual compression or single compression with solder balls
- 100 – 400 total pins
- Ideal for low cost board stacking, module-to-board and LGA interfaces
- Minimizes thermal expansion issues

MICRO PITCH ONE-PIECE
1.00 mm and .050" pitch one-piece interfaces for rugged and power applications.

Features:
- For high-shock, vibration, rugged applications
- Elevated and low profiles from 3 mm to 10 mm
- Optional screw mounts and alignment pins
- Single and double row designs

.100" (2.54 MM) PITCH ONE PIECE
One-piece interconnects in vertical and right-angle designs with large contact deflection.

Features:
- Current Rating: 2.4 A per pin
- Contacts: Up to 30 I/Os
- Screw insert option for rugged environments
- Alignment pins on either side of connector
- Large contact deflection
- Optional alignment pins

MICRO PITCH SYSTEMS
Board stacking interconnects on 0.40 mm, 0.50 mm, 0.635 mm, 0.80 mm, and 1.00 mm pitch with stack heights from 2.3 mm to 8 mm, vertical and right-angle orientations.

RAZOR BEAM™ LP
Ultra slim, ultra low profile and ultra fine pitch interconnects.

Features:
- Ultra fine pitch – 0.40 mm and 0.50 mm
- Ultra low stack down to 2.00 mm
- Slim body design for increased board space savings

0.50 MM (.0197") PITCH SYSTEMS
Micro Blade & Beam systems in a variety of stack heights and orientations for flexible stacking.

Features:
- Basic blade & beam system
- Low profile systems available
- Available up to 300 I/Os
- Several meet E.L.P.™ (Extended Life Product™) standards
- Hermaphroditic connectors available
- Various standard positions available up to 300
- Vertical and right-angle styles available

0.635 MM (.025") PITCH SYSTEMS
Basic Blade & Beam systems for flexible stacking.

Features:
- Basic blade & beam system
- Low profile systems available
- Available up to 300 I/Os
- Several meet E.L.P.™ (Extended Life Product™) standards
- Edge mount style available
 
0.80 MM (.0315") PITCH SYSTEMS
Flexible stacking interconnects available in a variety of contact systems, position counts, and low profile styles.

Features:
- Several contacts styles available
- Low profile systems available
- Available up to 300 I/Os
- Hermaphroditic connectors available
- Edge mount styles available
- Several meet E.L.P.™ (Extended Life Product™) standards

1.00 MM PITCH (.0394") SYSTEMS
Flexible stacking interconnects available in a variety of contact systems, position counts, and low profile styles.

Features:
- Various board stacking styles and options
- Rugged options available
- Up to 100 I/Os
- Flexible stack height features
- E.L.P.™ (Extended Life Product™) available

FLOATING CONTACT SYSTEM
High-speed floating contact system minimizes mating alignment errors.

Features:
- Provides 0.50 mm (.0197") float in X and Y directions
- Ideal for multiple connector, board-to-board applications
- Up to 60 floating contacts
- Choice of body height and right-angle design

MICRO RUGGED BOARD-TO-BOARD
Micro pitch interconnects with high-reliability Tiger Eye™ and rugged Edge Rate® contact systems for high mating cycles, high-shock and vibration applications; integral ground/power plane interconnects with increased contact wipe and insertion depth for rugged applications; self-mating interconnects with mating/unmating forces 4-6x greater than typical micro pitch connectors.

EDGE RATE® CONNECTOR STRIPS
Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features:
- Edge Rate® contacts optimized for signal integrity performance
- Robust when "zippered" during unmating
- 0.80 mm or 0.50 mm pitch systems
- Stack heights from 7 mm to 16 mm
- 0.50 mm pitch system for up to 40% PCB space savings

RUGGED TIGER EYE™ SYSTEMS
These rugged, high-reliability, high-cycle interconnects feature Samtec's Tiger Eye™ contact system.

Features:
- High-reliability Tiger Eye™ three-finger BeCu contact system
- Optional locking and latching systems for higher withdrawal force
- Extended Life Product™ testing available
- Standard and cost-saving designs

Q2™ RUGGED/HIGH-SPEED INTERCONNECTS
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features:
- Performance: Up to 8.5 GHz / 17 Gbps
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
- Power and RF ends options
- Contacts: Up to 208 I/Os
- Stack height: 10.00 mm - 16.00 mm

Q RATE® SLIM, RUGGED HIGH-SPEED INTERCONNECTS
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features:
- Performance: Up to 15 GHz / 30 Gbps
- Rugged Edge Rate® contacts
- Integral ground/power plane
- Up to 156 positions
- Slim footprint (less than 5.00 mm wide)

RAZOR BEAM™
High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features:
- 10 stack height options from 5 mm to 12 mm
- Audible click when mated
- Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
- Up to 100 contacts

FLOATING CONTACT SYSTEM
High-speed floating contact system minimizes mating alignment errors.

Features:
- Provides 0.50 mm (.0197") float in X and Y directions
- Ideal for multiple connectors on a board
- Up to 60 floating contacts
- Choice of body height and right-angle design

.050" SYSTEMS
.050" (1.27 mm) pitch board stacking socket and terminal strips in low profile and elevated stack heights, pass-through, rugged, high-density, and low cost designs.

.050" X .050" MICRO PITCH TERMINAL AND SOCKET STRIPS
.050" (1.27mm) x .050" (1.27mm) pitch board-to-board systems in a variety of board stacking heights, orientations and contact styles.

Features:
- Series up to 10,000 cycles
- Wide array of board stacking heights
- Various mating orientations
- Rugged options
- Numerous contact styles
- Stack heights .235" (5.91 mm) - .754" (19.15 mm)
- Available up to 100 pins