MICRO BACKPLANE SYSTEMS
Micro backplane systems include high-speed edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects in a variety of pitch, orientation and termination.

EDGE RATE® RUGGED, HIGH-SPEED CONNECTOR STRIPS
Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features:
- Edge Rate® contacts optimized for signal integrity performance
- Robust when "zippered" during unmating
- 0.80 mm or 0.50 mm pitch systems
- Stack heights from 7 mm to 16 mm
- 0.50 mm pitch system for up to 40% PCB space savings

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HIGH-SPEED EDGE CARD
High-speed edge card sockets with rugged Edge Rate® contacts.

Features:
- Performance: Up to 18.5 GHz / 37 Gbps
- Rugged Edge Rate® contacts
- Card slot: 1.60 mm (.062")
- Single-ended and differential pairs
- Vertical, right-angle, edge mount
- Optional board locks and cable latching features
- Optional weld tab for mechanical strength
- RU8 system for elevated board stacking

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1.00 MM PITCH HIGH-SPEED EDGE CARD
1.00 mm pitch high-speed edge card sockets with rugged Edge Rate® contacts and misalignment mitigation.

Features:
- Performance up to 14 GHz / 28 Gbps
- Rugged Edge Rate® contacts decrease crosstalk and increase cycle life
- 20 – 140 total pins
- Accepts .062" (1.60 mm) thick cards
- Optional weld tab and alignment pin

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MICRO EDGE CARD SYSTEMS
Micro pitch edge card sockets in a variety of centerlines and orientations.

Features:
- Performance: Up to 14.5 GHz / 29 Gbps
- Solutions for .062" (1.60 mm), and .093" (2.36 mm) thick cards
- Choice of pitch: 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, 2.00 mm
- Available in surface mount and through-hole
- Vertical, right-angle, edge mount

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Q RATE® SLIM, RUGGED HIGH-SPEED INTERCONNECTS
Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features:
- Performance: Up to 15 GHz / 30 Gbps
- Rugged Edge Rate® contacts
- Integral ground/power plane
- Up to 156 positions
- Slim footprint (less than 5.00 mm wide)

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Q STRIP® HIGH-SPEED INTERCONNECTS
Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential

Features:
- Performance: Up to 14.0 GHz /28 Gbps
- Integral ground/power plane
- Connector to connector retention options
- Vertical, perpendicular, and coplanar applications
- Contacts: Up to 180 I/Os
- Stack height: 5.00 mm - 25.00 mm

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Q2™ RUGGED/HIGH-SPEED INTERCONNECTS
These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features:
- Performance: Up to 8.5 GHz / 17 Gbps
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
- Power and RF ends options
- Contacts: Up to 208 I/Os
- Stack height: 10.00 mm - 16.00 mm

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SEARAY™ HIGH-DENSITY OPEN PIN FIELD ARRAYS
These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

Features:
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- Performance up to 18 GHz/pair
- Up to 500 I/Os in open pin field design
- 1.27 mm (.050") pitch and space saving 0.80 mm pitch
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- 7 - 17 mm stack heights
- Vertical, right-angle, press-fit
- Elevated systems to 40 mm
- 85 ohm systems
- VITA 47, VITA 57, Pismo 2 certified
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)

HIGH-SPEED BACKPLANE SYSTEMS
ExaMAX® high-speed backplane system enables 28 Gbps performance with a migration path to 56 Gbps and allows designers to optimize density or minimize board layer count. This system features two reliable points of contact, one-piece embossed ground structure on each signal wafer to reduce crosstalk and the lowest mating force on the market.

EXAMAX® HIGH-SPEED BACKPLANE CONNECTOR SYSTEM
ExaMAX® high-speed backplane interconnects deliver 28 Gbps electrical performance while offering a migration path to 56 Gbps.

Features:
- Enables 28 Gbps electrical performance on 2.00 mm column pitch
- Allows designers to optimize density or minimize board layer count
- Two reliable points of contact, even when subjected to angled mating
- Meets Telcordia GR-1217 CORE specification
- Individual signal wafers with staggered differential pair design; 72 or 40 pairs
- One-piece embossed ground structure on each signal wafer to reduce crosstalk
- Lowest mating force on the market: 0.36 N max per contact
- Stub free mating
- Press fit termination
- Power and Guide Modules available